Packaging Design with Thermal Analysis of LED on Silicon Substrate

In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to dissipate heat and match thermal expansion coefficient (CTE). The objective is to develop an LED package that can overcome LED life, high operating voltage, package degradation and the ability to drive the devices at higher power and higher brightness. To numerically predict the performance of packaging design, the optical and thermal characterization of the novel package structure was evaluated and simulated by TracePro and ANSYS software respectively. Research results have shown that silicon substrate can enhance heat removal for safe junction temperature operation and minimize thermal stress caused by mismatch of CTE.